A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC): Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, or 2.5D IC.
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- Chiplet (en)
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| - A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC): Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, or 2.5D IC. (en)
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| - Un chiplet és un petit circuit integrat (IC) que conté un subconjunt de funcionalitats ben definit. Està dissenyat per combinar-se amb altres chiplets en un interposador d'un únic encapsulat. Es pot implementar un conjunt de chiplets en un conjunt "com si fos un LEGO" de barreja i combinació. Això proporciona diversos avantatges respecte a un sistema tradicional en xip (SoC):
* IP reutilitzable (propietat intel·lectual): el mateix chiplet es pot utilitzar en molts dispositius diferents.
* Integració heterogènia: els chiplets es poden fabricar amb diferents processos, materials i nodes, cadascun optimitzat per a la seva funció particular.
* Bon troquel conegut: els chiplets es poden provar abans del muntatge, millorant el rendiment del dispositiu final. Diversos chiplets que treballen junts en un únic circuit integrat es poden anomenar mòdul multixip (MCM), o . (ca)
- A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "LEGO-like" assembly. This provides several advantages over a traditional system on chip (SoC):
* Reusable IP (Intellectual Property): the same chiplet can be used in many different devices
* Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
* Known good die: chiplets can be tested before assembly, improving the yield of the final device Multiple chiplets working together in a single integrated circuit may be called a multi-chip module (MCM), hybrid IC, or 2.5D IC. (en)
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