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About: Disco Corporation     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : yago:WikicatEquipmentSemiconductorCompanies, within Data Space : dbpedia.demo.openlinksw.com associated with source document(s)

Type: Thingcompanyschema:Organizationdul:Agentdul:SocialPersonagentwikidata:Q24229398OrganizationBusiness enterpriseyago:WikicatCompaniesEstablishedIn1937yago:WikicatManufacturingCompaniesOfJapanyago:Abstraction100002137yago:Company108058098yago:Group100031264yago:Institution108053576yago:Organization108008335yago:YagoLegalActoryago:YagoLegalActorGeoyago:YagoPermanentlyLocatedEntityorganisationyago:SocialGroup107950920yago:WikicatEquipmentSemiconductorCompanies New Facet based on Instances of this Class

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.