Airgap is a technique invented by IBM for fabricating small pockets of vacuum in between copper interconnects. The technique belongs to a general class of similar techniques that replaces solid low-κ dielectrics with air-filled or vacuum pockets.
Airgap is a technique invented by IBM for fabricating small pockets of vacuum in between copper interconnects. The technique belongs to a general class of similar techniques that replaces solid low-κ dielectrics with air-filled or vacuum pockets. (en)
Airgap is a technique invented by IBM for fabricating small pockets of vacuum in between copper interconnects. The technique belongs to a general class of similar techniques that replaces solid low-κ dielectrics with air-filled or vacuum pockets. (en)