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A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.

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rdfs:label
  • Mòdul multixip (ca)
  • Multi-Chip-Modul (de)
  • Módulo multichip (es)
  • Multi-chip module (en)
  • Multi-Chip Module (ja)
  • Багаточиповий модуль (uk)
  • 多晶片模組 (zh)
rdfs:comment
  • Un módulo multichip (multi-chip module, MCM) es un encapsulado especializado donde múltiples circuitos integrados (CI), matrices de semiconductores u otros componentes discretos, son empaquetados en un substrato unificado, facilitando su uso como un solo componente (como si fuera un CI más grande). El MCM en sí mismo a veces es mencionado como un chip en los diseños, ilustrando así su carácter integrado. A cada chip individual de un MCM se le llama chíplet. (es)
  • A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach. (en)
  • Multi-Chip Module（MCM）は、複数の集積回路（IC）のダイやモジュールなどを搭載して、1つのICのように取り扱いを容易にする、専用のエレクトリックパッケージである。MCMはその統合された性質から、設計ではMCM自体を「チップ」と呼ぶ場合もある。 (ja)
  • Багаточи́повий мо́дуль (англ. Multi-chip module, MCM) — спеціалізований електронний модуль, де інтегральні схеми (ІС), напівпровідникові чипи ("чиплети" англ. chiplets) або інші дискретні компоненти упаковані на об'єднуючій основі, що забезпечує їх використання як окремого компонента. (uk)
  • 多晶片模組，簡稱MCM（Multi-Chip Module），是一種裸晶（die）、晶片、積體電路的包裝、封裝技術（Package），此種封裝技術能在一個封裝內容納兩個或兩個以上的裸晶，而在此技術未發創前，一個封裝內多半只有一個裸晶。 MCM依據製造方式的不同而有不同的類型，差別主要在於（High Density Inteconnection；HDI）基板（Substrate）的形成方式： * MCM-L（Laminated MCM）層壓式MCM，基板部分用多層的薄型印刷電路板（Printed Circuit Board；PCB）所構成。 * MCM-D（Deposited MCM）堆積式MCM，將多片使用薄膜技術製成的基板加以疊堆而成。 * MCM-C（Ceramic Substrate MCM）陶瓷基板式MCM。 (zh)
  • Ein klassisches Multi-Chip-Modul (MCM, manchmal auch MCP von englisch Multi Chip Package) besteht aus mehreren einzelnen Mikrochips (bzw. Dies), die in einem gemeinsamen Gehäuse planar (nebeneinander) untergebracht sind und nach außen wie ein Chip aussehen, so funktionieren und eingesetzt werden. Von außen sind solche Chips also nicht direkt erkennbar, sondern sehen aus wie viele andere auch. Heute wendet man die Bezeichnung MCM auch auf die Module an, die neben Halbleiter-Dies mikromechanische Elemente oder auch diskrete passive Bauelemente wie z. B. Kondensatoren oder Widerstände in SMD-Bauformen (s. dazu surface-mounted device) beinhalten. Solche MCM sowie MCM mit vertikal angeordneten Komponenten (s. u. Die-Stacking) entsprechen viel mehr den Merkmalen eines System-in-Package. (de)
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