A probe card is an interface between an electronic test system and a semiconductor wafer. Typically the probe card is mechanically docked to a prober and electrically connected to a tester. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a printed circuit board (PCB) and some form of contact elements, usually metallic, but possibly of other materials as well.
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| - プローブカード (ja)
- Probe card (en)
- 探針卡 (zh)
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| - プローブカード (probe card) とは、半導体集積回路（LSI）の製造工程における、半導体試験装置で使用される接続治具（探針）である。 ウェーハ上に多数個のLSIの形成が完成した段階でウェーハを個々のLSIチップに切り離す前に全数行う機能テストに用いられ、主検査装置であるLSIテスタと被検査LSIチップとを電気的につなぐ目的で用いる。 特許や学術の分野では「探針付き基板」等と訳されることもあるが、現在では「プローブカード」が一般名称となっている。 (ja)
- 探針卡（英語：Probe card）是晶圓與电子测试系统之間的媒介。探針卡通常直接放在探測器上並用接線連接測試機。它的目的是提供晶片與測試機之間的連結，並完成。通常包印刷电路板和其他要件，這種要件可能是金屬或其他材料。 半導體製造商通常需要為不同種類的晶圓提供針對性的探針卡，因為探針卡是一種採用通用模式的定制連接器。為了測試DRAM和快閃記憶體，這些焊盤通常由鋁製成，其邊長為邊40-90μm。其他裝置可具有平墊，或由銅、銅合金或許多類型的焊料（例如鉛錫，錫銀等）製成的凸塊或柱。 探針卡在測試期間必須與焊盤或凸塊形成良好的電接觸。當測試完成時，探測卡根據測試結果，分類晶圓，並等待下一個測試。 通常將探針卡插入晶片探测器中，在此設備中操縱待測晶圓，使得晶圓與探針卡能精確接觸。測試機上一旦放入晶圓與探測卡，探針中的相機將使用光學定位探針卡上的尖端以及和晶片上的標記、，利用這個資訊，探針卡能精準對上焊盤。 (zh)
- A probe card is an interface between an electronic test system and a semiconductor wafer. Typically the probe card is mechanically docked to a prober and electrically connected to a tester. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a printed circuit board (PCB) and some form of contact elements, usually metallic, but possibly of other materials as well. (en)
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| - A probe card is an interface between an electronic test system and a semiconductor wafer. Typically the probe card is mechanically docked to a prober and electrically connected to a tester. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a printed circuit board (PCB) and some form of contact elements, usually metallic, but possibly of other materials as well. A semiconductor manufacturer will typically require a new probe card for each new device wafer and for device shrinks (when the manufacturer reduces the size of the device while keeping its functionality) because the probe card is effectively a custom connector that takes the universal pattern of a given tester and translates the signals to connect to electrical pads on the wafer. For testing of DRAM and FLASH memory devices these pads are typically made of aluminum and are 40–90 um per side. Other devices may have flat pads, or raised bumps or pillars made of copper, copper alloys or many types of solders such as lead-tin, tin-silver and others. The probe card must make good electrical contact to these pads or bumps during the testing of the device. When the testing of the device is complete, the prober will index the wafer to the next device to be tested. Probe cards are broadly classified into needle type, vertical type, and MEMS(Micro Electro-Mechanical System) type depending on shape and forms of contact elements. MEMS type is the most advanced technology currently available. The most advanced type of probe card currently can test an entire 12" wafer with one touchdown. Normally a probe card is inserted into an equipment called a wafer prober, inside which the position of the wafer to be tested will be adjusted to ensure a precise contact between the probe card and wafer. Once the probe card and the wafer is loaded, a camera in the prober will optically locate several tips on the probe card and several marks or pads on the wafer, and using this information it will align the pads on the device under test (DUT) to the probe card contacts. Probe card efficiency is affected by many factors. Perhaps the most important factor impacting probe card efficiency is the number of DUTs that can be tested in parallel. Many wafers today are still tested one device at a time. If one wafer had 1000 of these devices and the time required to test one device was 10 seconds and the time for the prober to move from one device to another device was 1 second, then to test an entire wafer would take 1000 x 11 seconds = 11,000 seconds or roughly 3 hours. If however, the probe card and the tester could test 16 devices in parallel (with 16 times the electrical connections) than the test time would be reduced by almost exactly 16 times (around 11 minutes). Note that because now the probe card has 16 devices, as the prober touches down on the round wafer, it may not always contact an active device and will therefore be a little less than 16 times as fast to test one wafer. Another major factor is debris that accumulates on the tips of the probe needles. Normally these are made of tungsten or tungsten/rhenium alloys or advanced palladium based alloys like PdCuAg. Some modern probe cards have contact tips manufactured by MEMS technologies. Irrespective of the probe tip material, contamination builds up on the tips as a result of successive touch down events (where the probe tips make physical contact with the bond pads of the die). Accumulation of debris has an adverse effect on the critical measurement of contact resistance. To return a used probe card to a contact resistance that is acceptable the probe tips need to be thoroughly cleaned. Cleaning can be done offline using an NWR style laser to reclaim the tips by selectively removing the contamination. Online cleaning can be used during testing to optimize the testing results within the wafer or within wafer lots. (en)
- プローブカード (probe card) とは、半導体集積回路（LSI）の製造工程における、半導体試験装置で使用される接続治具（探針）である。 ウェーハ上に多数個のLSIの形成が完成した段階でウェーハを個々のLSIチップに切り離す前に全数行う機能テストに用いられ、主検査装置であるLSIテスタと被検査LSIチップとを電気的につなぐ目的で用いる。 特許や学術の分野では「探針付き基板」等と訳されることもあるが、現在では「プローブカード」が一般名称となっている。 (ja)
- 探針卡（英語：Probe card）是晶圓與电子测试系统之間的媒介。探針卡通常直接放在探測器上並用接線連接測試機。它的目的是提供晶片與測試機之間的連結，並完成。通常包印刷电路板和其他要件，這種要件可能是金屬或其他材料。 半導體製造商通常需要為不同種類的晶圓提供針對性的探針卡，因為探針卡是一種採用通用模式的定制連接器。為了測試DRAM和快閃記憶體，這些焊盤通常由鋁製成，其邊長為邊40-90μm。其他裝置可具有平墊，或由銅、銅合金或許多類型的焊料（例如鉛錫，錫銀等）製成的凸塊或柱。 探針卡在測試期間必須與焊盤或凸塊形成良好的電接觸。當測試完成時，探測卡根據測試結果，分類晶圓，並等待下一個測試。 通常將探針卡插入晶片探测器中，在此設備中操縱待測晶圓，使得晶圓與探針卡能精確接觸。測試機上一旦放入晶圓與探測卡，探針中的相機將使用光學定位探針卡上的尖端以及和晶片上的標記、，利用這個資訊，探針卡能精準對上焊盤。 (zh)
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