About: Quilt packaging

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Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections. QP nodules are created as an integral part of the microchip using standard back end of the line semiconductor device fabrication techniques. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.

Attributes	Values
rdf:type	company
rdfs:label	Quilt packaging (en)
rdfs:comment	Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections. QP nodules are created as an integral part of the microchip using standard back end of the line semiconductor device fabrication techniques. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy. (en)
foaf:depiction
dcterms:subject	Packaging (microfabrication)
Wikipage page ID	19345769 (xsd:integer)
Wikipage revision ID	990429382 (xsd:integer)
Link from a Wikipage to another Wikipage	Electroplating Insertion loss Integrated circuit packaging Gallium arsenide Gallium nitride Silicon carbide Packaging (microfabrication) Semiconductor device fabrication Radio frequency Back end of line Coupling loss Bit rate System in package Terminal (electronics) Copper interconnect Multi-chip module Semiconductor Semiconductor device Silicon Three-dimensional integrated circuit S-parameter
sameAs	Quilt packaging Quilt packaging Quilt packaging Quilt packaging
dbp:wikiPageUsesTemplate	dbt:Semiconductor_packages dbt:Multiple_image dbt:Reflist
thumbnail	wiki-commons:Special:FilePath/Concept_Image_of_Quilt_Packaging_Nodules_and_RDL_Metal.jpg?width=300
footer	QP Chiplets can be quilted together in most any orientation. (en)
image	3 (xsd:integer) Hemispherical Curved Multi-Chip Array using Quilt Packaging.jpg (en)
perrow	1 (xsd:integer)
total width	225 (xsd:integer)
has abstract	Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes “nodule” structures that extend out horizontally from the edges of microchips to make electrically and mechanically robust chip-to-chip interconnections. QP nodules are created as an integral part of the microchip using standard back end of the line semiconductor device fabrication techniques. Solder is then electroplated on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy. Small high yielding “chiplets” made from any semiconductor material (Silicon, Gallium Arsenide, Silicon Carbide, Gallium Nitride, etc.), can be “quilted” together to create larger multi-function meta-chip. Thus, QP technology can integrate multiple chips with dissimilar technologies or substrate materials in planar, 2.5D and 3D configurations. (en)
gold:hypernym	Packaging
prov:wasDerivedFrom	wikipedia-en:Quilt_packaging?oldid=990429382&ns=0
page length (characters) of wiki page	7102 (xsd:nonNegativeInteger)
foaf:isPrimaryTopicOf	wikipedia-en:Quilt_packaging
is Link from a Wikipage to another Wikipage of	Integrated circuit packaging Packaging (disambiguation) Glossary of microelectronics manufacturing terms Advanced packaging (semiconductors) System in a package
is Wikipage disambiguates of	Packaging (disambiguation)
is foaf:primaryTopic of	wikipedia-en:Quilt_packaging

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