About: TO-263

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The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. * * A TO-220 package compared to a D2PAK package.

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rdfs:label	D2PAK (es) TO-263 (nl) TO-263 (en)
rdfs:comment	El D2PAK o DDPAK, también conocido como (TO-263), se refiere a un tipo de encapsulados destinados al montaje en la superficie de placas en circuitos. Son similares a los anteriores estilo TO-220, encapsulados destinados a la disipación de energía, pero carecen de la pestaña de metálica extendida y orificio de montaje. Al igual que con todos los paquetes de SMT, los pines en un D2PAK se doblan para encastrase contra la superficie de PCB. (es) The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. * * A TO-220 package compared to a D2PAK package. (en) De Double Decawatt Package, D2PAK, DDPAK, SOT404, gestandaardiseerd als TO-263, is een surface-mount halfgeleiderbehuizing ontworpen door Motorola. De TO-263 is vergelijkbaar met de TO-220 behuizing die bedoeld zijn voor een hoge vermogensdissipatie. Ze missen alleen het verlengde metalen lipje en montagegat. Zoals bij alle surface-mount behuizingen, zijn de pinnen op een D2PAK gebogen om tegen het PCB- oppervlak te liggen. De TO-263 behuizingen hebben vaak 3 pinnen maar zijn ook versies met meer of minder pinnen. * Een paar met de surface mount behuizing D2PAK. * (nl)
foaf:depiction
dcterms:subject	Semiconductor packages
Wikipage page ID	26661576 (xsd:integer)
Wikipage revision ID	1045269188 (xsd:integer)
Link from a Wikipage to another Wikipage	Semiconductor packages Semiconductor package Motorola MOSFETs Through-hole technology Fairchild Semiconductor National Semiconductor ON Semiconductor Printed circuit board Surface-mount technology TO-252 TO-220 Circuit board Power dissipation Surface mount
Link from a Wikipage to an external page	https://web.archive.org/web/20100120032328/http:/www.national.com/packaging/folders/ts3b.html https://web.archive.org/web/20130201030836/http:/www.fairchildsemi.com/package/packageDetails.html%3Fid=PN_TT263-0R2 http://www.onsemi.com/pub_link/Collateral/418AJ.PDF
sameAs	TO-263 TO-263 TO-263 TO-263 TO-263 TO-263
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thumbnail	wiki-commons:Special:FilePath/TO-263AA_Back_Top.svg?width=300
align	right (en)
caption	3 (xsd:integer) TO-263AA back view (en) TO-263AA front view (en)
direction	vertical (en)
image	TO-263-3_TabPin2.wrl.stl (en) TO-263AA Back Bottom.svg (en) TO-263AA Back Top.svg (en)
width	165 (xsd:integer)
has abstract	El D2PAK o DDPAK, también conocido como (TO-263), se refiere a un tipo de encapsulados destinados al montaje en la superficie de placas en circuitos. Son similares a los anteriores estilo TO-220, encapsulados destinados a la disipación de energía, pero carecen de la pestaña de metálica extendida y orificio de montaje. Al igual que con todos los paquetes de SMT, los pines en un D2PAK se doblan para encastrase contra la superficie de PCB. (es) The Double Decawatt Package, D2PAK, SOT404 or DDPAK, standardized as TO-263, refers to a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola. They are similar to the earlier TO-220-style packages intended for high power dissipation but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package. As with all SMT packages, the pins on a D2PAK are bent to lie against the PCB surface. The TO-263 can have 3 to 7 terminals. * A pair of MOSFETs in the surface-mount package D2PAK. * A TO-220 package compared to a D2PAK package. (en) De Double Decawatt Package, D2PAK, DDPAK, SOT404, gestandaardiseerd als TO-263, is een surface-mount halfgeleiderbehuizing ontworpen door Motorola. De TO-263 is vergelijkbaar met de TO-220 behuizing die bedoeld zijn voor een hoge vermogensdissipatie. Ze missen alleen het verlengde metalen lipje en montagegat. Zoals bij alle surface-mount behuizingen, zijn de pinnen op een D2PAK gebogen om tegen het PCB- oppervlak te liggen. De TO-263 behuizingen hebben vaak 3 pinnen maar zijn ook versies met meer of minder pinnen. * Een paar met de surface mount behuizing D2PAK. * Een TO-220 behuizing vergeleken met een D2PAK behuizing. (nl)
prov:wasDerivedFrom	wikipedia-en:TO-263?oldid=1045269188&ns=0
page length (characters) of wiki page	3244 (xsd:nonNegativeInteger)
foaf:isPrimaryTopicOf	wikipedia-en:TO-263
is Link from a Wikipage to another Wikipage of	SOT-404 SOT404 List of integrated circuit packaging types Power MOSFET TO263 D2PAK 3Com 3c509 DDPAK TO-252 TO-220 Double decawatt package
is Wikipage redirect of	SOT-404 SOT404 TO263 D2PAK DDPAK Double decawatt package
is foaf:primaryTopic of	wikipedia-en:TO-263

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