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About: Three-dimensional integrated circuit     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : yago:Whole100003553, within Data Space : dbpedia.demo.openlinksw.com associated with source document(s)

Type: baseball leagueyago:Artifact100021939yago:Circuit103033362yago:ComputerCircuit103084420yago:Device103183080yago:ElectricalDevice103269401yago:Instrumentality103575240yago:IntegratedCircuit103577090yago:Object100002684yago:PhysicalEntity100001930yago:WikicatIntegratedCircuitsyago:Whole100003553 New Facet based on Instances of this Class

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.