Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was invented by Michel Bruel of CEA-Leti, and was protected by US patent 5374564. The application of this technological procedure is mainly in the production of silicon-on-insulator (SOI) wafer substrates. The sequence of illustrations pictorially describes the process involved in fabricating SOI wafers using the smart cut technology.
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