About: Wafer bonding     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : yago:Whole100003553, within Data Space : dbpedia.demo.openlinksw.com associated with source document(s)
QRcode icon
http://dbpedia.demo.openlinksw.com/describe/?url=http%3A%2F%2Fdbpedia.org%2Fresource%2FWafer_bonding

Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s.

AttributesValues
rdf:type
rdfs:label
  • Wafer bonding (en)
  • Waferbonden (de)
  • Collegamento su wafer (it)
  • 基板接合 (ja)
rdfs:comment
  • Das Waferbonden ist ein Verfahrensschritt in der Halbleiter- und Mikrosystemtechnik, bei dem zwei Wafer oder Scheiben (Silizium, Quarz, Glas und andere) miteinander verbunden werden.In der Mikrosystemtechnik wird Waferbonden genutzt, um die für die Sensoren nötigen Kavitäten herzustellen, so z. B. die Referenzdruckkammer bei einem absoluten Drucksensor oder die Unterdruckkammer einiger Drehratensensoren. (de)
  • 基板接合（きばんせつごう、Wafer bonding）とは、基板を接合する技術であり、半導体集積回路作製技術やMEMS作製技術として使用される。主にシリコン基板同士またはシリコン基板と異種材料の基板を接合するために用いられる。 (ja)
  • Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. (en)
  • Il collegamento su wafer, noto anche con l'espressione inglese wafer bonding, è una cosiddetta a livello di wafer (wafer-level packaging technology) per la fabbricazione di sistemi microelettromeccanici (microelectromechanical systems, MEMS), di sistemi nanoelettromeccanici (nanoelectromechanical systems, NEMS), di microelettronica e optoelettronica, che garantisce un incapsulamento meccanicamente stabile ed ermeticamente sigillato. Il diametro dei wafer varia da 100 mm a 200 mm (da 4 pollici a 8 pollici) per gli MEMS/NEMS e fino a 300 mm (12 pollici) per la produzione di dispositivi microelettronici. (it)
dcterms:subject
Wikipage page ID
Wikipage revision ID
Link from a Wikipage to another Wikipage
sameAs
dbp:wikiPageUsesTemplate
has abstract
  • Das Waferbonden ist ein Verfahrensschritt in der Halbleiter- und Mikrosystemtechnik, bei dem zwei Wafer oder Scheiben (Silizium, Quarz, Glas und andere) miteinander verbunden werden.In der Mikrosystemtechnik wird Waferbonden genutzt, um die für die Sensoren nötigen Kavitäten herzustellen, so z. B. die Referenzdruckkammer bei einem absoluten Drucksensor oder die Unterdruckkammer einiger Drehratensensoren. (de)
  • 基板接合（きばんせつごう、Wafer bonding）とは、基板を接合する技術であり、半導体集積回路作製技術やMEMS作製技術として使用される。主にシリコン基板同士またはシリコン基板と異種材料の基板を接合するために用いられる。 (ja)
  • Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. (en)
  • Il collegamento su wafer, noto anche con l'espressione inglese wafer bonding, è una cosiddetta a livello di wafer (wafer-level packaging technology) per la fabbricazione di sistemi microelettromeccanici (microelectromechanical systems, MEMS), di sistemi nanoelettromeccanici (nanoelectromechanical systems, NEMS), di microelettronica e optoelettronica, che garantisce un incapsulamento meccanicamente stabile ed ermeticamente sigillato. Il diametro dei wafer varia da 100 mm a 200 mm (da 4 pollici a 8 pollici) per gli MEMS/NEMS e fino a 300 mm (12 pollici) per la produzione di dispositivi microelettronici. (it)
gold:hypernym
prov:wasDerivedFrom
page length (characters) of wiki page
foaf:isPrimaryTopicOf
is Link from a Wikipage to another Wikipage of
is foaf:primaryTopic of
Faceted Search & Find service v1.17_git139 as of Feb 29 2024


Alternative Linked Data Documents: ODE     Content Formats:   [cxml] [csv]     RDF   [text] [turtle] [ld+json] [rdf+json] [rdf+xml]     ODATA   [atom+xml] [odata+json]     Microdata   [microdata+json] [html]    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 08.03.3330 as of Mar 19 2024, on Linux (x86_64-generic-linux-glibc212), Single-Server Edition (378 GB total memory, 51 GB memory in use)
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2024 OpenLink Software