. "Chip-scale-Package (amb acr\u00F2nim angl\u00E8s CSP) \u00E9s un tipus d'encapsulat per a circuits integrats. El seu nom ve del fet que l'encapsulat \u00E9s pr\u00E0cticament tan petiti com el dau de silici. Segons la norma J-STD-012 de l'IPC, l'encapsulat CSP ha de tenir una \u00E0rea no superior a 1,2 cops l'\u00E0rea del dau de silici. La idea original la va proposar Junichi Kasai de Fujitsu i Gen Murakami d'Hitachi Cable. La primera implementaci\u00F3 va venir de Mirsubishi Electric."@ca . . . . . "3460"^^ . . . . "Chip Scale Package"@de . "\u041A\u043E\u0440\u043F\u0443\u0441 \u0437 \u0440\u043E\u0437\u043C\u0456\u0440\u0430\u043C\u0438, \u0431\u043B\u0438\u0437\u044C\u043A\u0438\u043C\u0438 \u0434\u043E \u0440\u043E\u0437\u043C\u0456\u0440\u0443 \u043A\u0440\u0438\u0441\u0442\u0430\u043B\u0430 (CSP, \u0430\u043D\u0433\u043B. Chip-scale package) \u2014 \u043E\u0434\u0438\u043D \u0437 \u0442\u0438\u043F\u0456\u0432 \u043A\u043E\u0440\u043F\u0443\u0441\u0443 \u0456\u043D\u0442\u0435\u0433\u0440\u043E\u0432\u0430\u043D\u043E\u0457 \u0441\u0445\u0435\u043C\u0438. \u0421\u043F\u043E\u0447\u0430\u0442\u043A\u0443 CSP \u0446\u0435 \u0431\u0443\u0432 \u043B\u0438\u0448\u0435 \u0430\u043A\u0440\u043E\u043D\u0456\u043C \u0434\u043B\u044F \u043D\u0430\u043F\u0440\u044F\u043C\u0443 \u0442\u0435\u0445\u043D\u043E\u043B\u043E\u0433\u0456\u0457 \u043A\u043E\u0440\u043F\u0443\u0441\u0443\u0432\u0430\u043D\u043D\u044F. \u041F\u043E\u0442\u0456\u043C \u0437\u043D\u0430\u0447\u0435\u043D\u043D\u044F \u0430\u0431\u0440\u0435\u0432\u0456\u0430\u0442\u0443\u0440\u0438 \u0431\u0443\u043B\u043E \u0441\u0442\u0430\u043D\u0434\u0430\u0440\u0442\u043E\u043C \u0437\u0430\u043A\u0440\u0456\u043F\u043B\u0435\u043D\u043E \u0437\u0430 \u043F\u0435\u0432\u043D\u0438\u043C \u0442\u0438\u043F\u043E\u043C. \u0423 \u0432\u0456\u0434\u043F\u043E\u0432\u0456\u0434\u043D\u043E\u0441\u0442\u0456 \u0437\u0456 \u0441\u0442\u0430\u043D\u0434\u0430\u0440\u0442\u043E\u043C J-STD-012, \u0434\u043B\u044F \u0442\u043E\u0433\u043E \u0449\u043E\u0431 \u043A\u0432\u0430\u043B\u0456\u0444\u0456\u043A\u0443\u0432\u0430\u0442\u0438\u0441\u044F \u044F\u043A CSP, \u043A\u043E\u0440\u043F\u0443\u0441 \u043F\u043E\u0432\u0438\u043D\u0435\u043D \u043F\u0435\u0440\u0435\u0432\u0438\u0449\u0443\u0432\u0430\u0442\u0438 \u043F\u043B\u043E\u0449\u0443 \u0447\u0438\u043F\u0430 \u043D\u0435 \u0431\u0456\u043B\u044C\u0448\u0435 \u043D\u0456\u0436 \u0432 1,2 \u0440\u0430\u0437\u0438. \u0429\u0435 \u043E\u0434\u0438\u043D \u043A\u0440\u0438\u0442\u0435\u0440\u0456\u0439, \u044F\u043A\u0438\u0439 \u0447\u0430\u0441\u0442\u043E \u0437\u0430\u0441\u0442\u043E\u0441\u043E\u0432\u0443\u0454\u0442\u044C\u0441\u044F, \u0449\u043E\u0431 \u043A\u0432\u0430\u043B\u0456\u0444\u0456\u043A\u0443\u0432\u0430\u0442\u0438 \u0446\u0456 \u043A\u043E\u0440\u043F\u0443\u0441\u0438, \u0454 \u043A\u0440\u043E\u043A \u043C\u0430\u0442\u0440\u0438\u0446\u0456 \u0432\u0438\u0432\u043E\u0434\u0456\u0432, \u044F\u043A\u0438\u0439 \u043F\u043E\u0432\u0438\u043D\u0435\u043D \u0431\u0443\u0442\u0438 \u043D\u0435 \u0431\u0456\u043B\u044C\u0448\u0435 1 \u043C\u043C."@uk . "Chip-scale-Package (amb acr\u00F2nim angl\u00E8s CSP) \u00E9s un tipus d'encapsulat per a circuits integrats. El seu nom ve del fet que l'encapsulat \u00E9s pr\u00E0cticament tan petiti com el dau de silici. Segons la norma J-STD-012 de l'IPC, l'encapsulat CSP ha de tenir una \u00E0rea no superior a 1,2 cops l'\u00E0rea del dau de silici. La idea original la va proposar Junichi Kasai de Fujitsu i Gen Murakami d'Hitachi Cable. La primera implementaci\u00F3 va venir de Mirsubishi Electric."@ca . "Chip Scale Package (CSP, engl.; zu deutsch Geh\u00E4use in der Gr\u00F6\u00DFenordnung des Die) ist ein Chipgeh\u00E4use von integrierten Schaltungen, bei dem das Geh\u00E4use maximal 20 % mehr Fl\u00E4che als das Die ausmacht, wozu ersichtlich die Anschl\u00FCsse f\u00FCr SMD-Best\u00FCckung ohne Bonding mit dem Die verbunden werden m\u00FCssen. Um die geringe Geh\u00E4use-Grundfl\u00E4che erreichen zu k\u00F6nnen, wird entweder die Flip-Chip-Montage (der Die wird nach Metallisierung seiner externen Kontakte umgekehrt auf das Board gelegt) oder die WLCSP-Methode genutzt. Bei der WLCSP-Methode wird zum Schutz des Die unten ein Schutzlack und von oben ein Plastik-Geh\u00E4use aufgebracht. Das CSP stellt somit eine Fortentwicklung des Ball Grid Array (BGA) dar, was auf Ideen von Mitarbeitern von Fujitsu und Hitachi Cable zur\u00FCckgeht und erstmals von Mitsubishi Electric realisiert wurde. Die mechanische Belastbarkeit des CSP ist im Vergleich zum BGA wesentlich geringer, da Kr\u00E4fte von den L\u00F6tstellen direkt auf den Die \u00FCbertragen werden. Eine Verkleinerung der Geh\u00E4use ist etwa in der Medizintechnik, zum Beispiel f\u00FCr verschluckbare Diagnose-Ger\u00E4te, und in der Hochfrequenztechnik f\u00FCr kurze \u00DCbertragungswege n\u00FCtzlich."@de . . . "1015098137"^^ . . . . "2036147"^^ . . "A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm."@en . . . . . . . . "\u6676\u7247\u5C3A\u5BF8\u5C01\u88DD"@zh . . "Chip-scale package"@ca . . . . . . . . . . . . . "A chip scale package or chip-scale package (CSP) is a type of integrated circuit package. Originally, CSP was the acronym for chip-size packaging. Since only a few packages are chip size, the meaning of the acronym was adapted to chip-scale packaging. According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm. The concept was first proposed by Junichi Kasai of Fujitsu and Gen Murakami of Hitachi Cable in 1993. The first concept demonstration however came from Mitsubishi Electric. The die may be mounted on an interposer upon which pads or balls are formed, like with flip chip ball grid array (BGA) packaging, or the pads may be etched or printed directly onto the silicon wafer, resulting in a package very close to the size of the silicon die: such a package is called a wafer-level package (WLP) or a wafer-level chip-scale package (WL-CSP). WL-CSP had been in development since 1990s, and several companies begun volume production in early 2000, such as Advanced Semiconductor Engineering (ASE)."@en . . . . "Chip-scale package"@en . . "\u6676\u7247\u5C3A\u5BF8\u69CB\u88DD\uFF08Chip Scale Package, CSP\uFF09\u662F\u4E00\u7A2E\u534A\u5C0E\u9AD4\u69CB\u88DD\u6280\u8853\u3002 \u6700\u65E9CSP\u53EA\u662F\u6676\u7247\u5C3A\u5BF8\u5C01\u88DD\u7684\u7E2E\u5BEB\u3002\u6839\u64DAIPC\u7684\u6A19\u6E96J-STD-012, \"Implementation of Flip Chip and Chip Scale Technology\"\uFF0C\u4EE5\u7B26\u5408\u6676\u7247\u898F\u6A21\uFF0C\u5C01\u88C5\u5FC5\u9808\u6709\u4E00\u500B\u9762\u7A4D\u4E0D\u8D85\u904E1.2\u500D\uFF0C\u66F4\u5927\u7684\u6A21\u5177\u548C\u5B83\u5FC5\u9808\u4E00\u500B\u55AE\u6676\u7247\uFF0C\u76F4\u63A5\u8868\u9762\u8CBC\u88DD\u5C01\u88DD\u3002 \u7531\u65BC\u53EF\u651C\u5F0F\u96FB\u5B50\u7522\u54C1\u7684\u5916\u5F62\u5C3A\u5BF8\u65E5\u8DA8\u7E2E\u5C0F\uFF0C\u5BCC\u58EB\u901A\u548C\u65E5\u7ACB\u96FB\u7DDA\u8DDFMurakami\u9996\u6B21\u63D0\u51FA\u4E86\u9019\u4E00\u6982\u5FF5\u3002\u7136\u800C\uFF0C\u7B2C\u4E00\u500B\u6982\u5FF5\u6F14\u793A\u4F86\u81EA\u4E09\u83F1\u96FB\u6A5F\u3002 \u6676\u7247\u5C3A\u5BF8\u69CB\u88DD\u662F\u5728TSOP\u3001\u7403\u67F5\u9663\u5217\uFF08BGA\uFF09\u7684\u57FA\u7840\u4E0A\uFF0C\u53EF\u8755\u523B\u6216\u76F4\u63A5\u5370\u5728\u77FD\u7247\uFF0C\u5C0E\u81F4\u5728\u4E00\u500B\u5305\uFF0C\u975E\u5E38\u63A5\u8FD1\u77FD\u7247\u7684\u5927\u5C0F\uFF1A\u9019\u7A2E\u5305\u88DD\u88AB\u7A31\u70BA\u6676\u5713\u7D1A\u82AF\u7247\u898F\u6A21\u5C01\u88DD\uFF08WL-CSP\uFF09\u6216\u6676\u5713\u7D1A\u5C01\u88DD\uFF08WLP\uFF09\u3002 \u9632\u6F6E\u53EF\u9760\u6027\u512A\u7570\u7684CSP\u578B\u534A\u5C0E\u9AD4\u5668\u4EF6\u4F9D\u8CF4\u65BC\u7528\u65BC\u88FD\u9020\u534A\u5C0E\u9AD4\u5668\u4EF6\u7684\u534A\u5C0E\u9AD4\u5668\u4EF6\u7684\u805A\u9170\u4E9E\u80FA\u5E36\u8584\u819C\u8F09\u9AD4\u3002CSP\u534A\u5C0E\u9AD4\u5668\u4EF6\u7684\u65B9\u6CD5\uFF0C\u8A72\u65B9\u6CD5\u5305\u62EC\uFF1A \n* \u6E96\u5099\u8F14\u52A9\u4F48\u7DDA\u677F\uFF0C\u5177\u6709\u81F3\u5C11\u4E00\u500B\u96FB\u6975\u7684\u534A\u5C0E\u9AD4\u82AF\u7247\u4EE5\u53CA\u71B1\u710A\u63A5\u3002 \n* \u805A\u9170\u4E9E\u80FA\u8584\u819C; \u8F14\u52A9\u4F48\u7DDA\u677F\u7528\u65BC\u5728\u5176\u4E0A\u5B89\u88DD\u534A\u5C0E\u9AD4\u82AF\u7247\uFF0C\u4E26\u4E14\u5177\u6709\u5728\u5176\u5167\u90E8\u4F48\u7F6E\u81F3\u5C11\u4E00\u500B\u5F15\u51FA\u5C0E\u9AD4\u7684\u7D50\u69CB\uFF0C\u8A72\u5F15\u51FA\u5C0E\u9AD4\u7684\u4E00\u7AEF\u5F62\u6210\u5F9E\u8F14\u52A9\u4F48\u7DDA\u677F\u7684\u5074\u9762\u7A81\u51FA\u7684\u5167\u90E8\u96FB\u6975\u3002 \n* \u7528\u65BC\u5B89\u88DD\u534A\u5C0E\u9AD4\u82AF\u7247\uFF0C\u4E26\u4E14\u5F15\u51FA\u5C0E\u9AD4\u7684\u53E6\u4E00\u7AEF\u5F62\u6210\u5916\u90E8\u4F48\u7DDA\u96FB\u6975\uFF0C\u8A72\u5916\u90E8\u4F48\u7DDA\u96FB\u6975\u5F9E\u8F14\u52A9\u4F48\u7DDA\u677F\u7684\u8207\u5B89\u88DD\u534A\u5C0E\u9AD4\u82AF\u7247\u7684\u4E00\u5074\u76F8\u53CD\u7684\u4E00\u5074\u7684\u8868\u9762\u7A81\u51FA\u3002 \n* \u901A\u904E\u71B1\u710A\u63A5\u5C07\u534A\u5C0E\u9AD4\u82AF\u7247\u4EE5\u5176\u96FB\u6975\u5074\u70BA\u4E0B\u5074\u7684\u72C0\u614B\u5B89\u88DD\u5728\u8F14\u52A9\u4F48\u7DDA\u677F\u4E0A\u3002 \n* \u805A\u9170\u4E9E\u80FA\u8584\u819C \u7194\u5316\u71B1\u710A\u805A\u9170\u4E9E\u80FA \u901A\u904E\u5728\u8A72\u72C0\u614B\u4E0B\u52A0\u71B1\u7684\u540C\u6642\u5C07\u8F14\u52A9\u914D\u7DDA\u677F\u548C\u534A\u5C0E\u9AD4\u82AF\u7247\u5F7C\u6B64\u58D3\u63A5\u89F8\u4E26\u56FA\u5316\u6A39\u8102\u4EE5\u5F62\u6210\u71B1\u7194\u63A5\u819C\uFF0C\u5F9E\u800C\u5F62\u6210\u8584\u819C\u3002 \n* \u805A\u9170\u4E9E\u80FA\u6A39\u8102\u5C64\uFF0C\u5F9E\u800C\u5C01\u88DD\u8F14\u52A9\u4F48\u7DDA\u677F\u548C\u534A\u5C0E\u9AD4\u82AF\u7247\u4E4B\u9593\u7684\u9593\u9699\uFF0C\u4E26\u4E14\u5728\u5C01\u88DD\u6642\u6216\u5728\u5C01\u88DD\u4E4B\u5F8C\uFF0C\u5C07\u8F14\u52A9\u4F48\u7DDA\u677F\u7684\u5167\u90E8\u96FB\u6975\u9023\u63A5\u5230\u534A\u5C0E\u9AD4\u82AF\u7247\u7684\u96FB\u6975\u3002 \u805A\u9170\u4E9E\u80FA\u8584\u819C\u7684\u4E3B\u8981\u88FD\u9020\u5546\u5305\u62EC\u675C\u90A6 \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09\uFF0CTory Industries \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09\uFF0CToyotape \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09\uFF0CSKC Kolon PI \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09"@zh . . . . . . . "\u6676\u7247\u5C3A\u5BF8\u69CB\u88DD\uFF08Chip Scale Package, CSP\uFF09\u662F\u4E00\u7A2E\u534A\u5C0E\u9AD4\u69CB\u88DD\u6280\u8853\u3002 \u6700\u65E9CSP\u53EA\u662F\u6676\u7247\u5C3A\u5BF8\u5C01\u88DD\u7684\u7E2E\u5BEB\u3002\u6839\u64DAIPC\u7684\u6A19\u6E96J-STD-012, \"Implementation of Flip Chip and Chip Scale Technology\"\uFF0C\u4EE5\u7B26\u5408\u6676\u7247\u898F\u6A21\uFF0C\u5C01\u88C5\u5FC5\u9808\u6709\u4E00\u500B\u9762\u7A4D\u4E0D\u8D85\u904E1.2\u500D\uFF0C\u66F4\u5927\u7684\u6A21\u5177\u548C\u5B83\u5FC5\u9808\u4E00\u500B\u55AE\u6676\u7247\uFF0C\u76F4\u63A5\u8868\u9762\u8CBC\u88DD\u5C01\u88DD\u3002 \u7531\u65BC\u53EF\u651C\u5F0F\u96FB\u5B50\u7522\u54C1\u7684\u5916\u5F62\u5C3A\u5BF8\u65E5\u8DA8\u7E2E\u5C0F\uFF0C\u5BCC\u58EB\u901A\u548C\u65E5\u7ACB\u96FB\u7DDA\u8DDFMurakami\u9996\u6B21\u63D0\u51FA\u4E86\u9019\u4E00\u6982\u5FF5\u3002\u7136\u800C\uFF0C\u7B2C\u4E00\u500B\u6982\u5FF5\u6F14\u793A\u4F86\u81EA\u4E09\u83F1\u96FB\u6A5F\u3002 \u6676\u7247\u5C3A\u5BF8\u69CB\u88DD\u662F\u5728TSOP\u3001\u7403\u67F5\u9663\u5217\uFF08BGA\uFF09\u7684\u57FA\u7840\u4E0A\uFF0C\u53EF\u8755\u523B\u6216\u76F4\u63A5\u5370\u5728\u77FD\u7247\uFF0C\u5C0E\u81F4\u5728\u4E00\u500B\u5305\uFF0C\u975E\u5E38\u63A5\u8FD1\u77FD\u7247\u7684\u5927\u5C0F\uFF1A\u9019\u7A2E\u5305\u88DD\u88AB\u7A31\u70BA\u6676\u5713\u7D1A\u82AF\u7247\u898F\u6A21\u5C01\u88DD\uFF08WL-CSP\uFF09\u6216\u6676\u5713\u7D1A\u5C01\u88DD\uFF08WLP\uFF09\u3002 \u9632\u6F6E\u53EF\u9760\u6027\u512A\u7570\u7684CSP\u578B\u534A\u5C0E\u9AD4\u5668\u4EF6\u4F9D\u8CF4\u65BC\u7528\u65BC\u88FD\u9020\u534A\u5C0E\u9AD4\u5668\u4EF6\u7684\u534A\u5C0E\u9AD4\u5668\u4EF6\u7684\u805A\u9170\u4E9E\u80FA\u5E36\u8584\u819C\u8F09\u9AD4\u3002CSP\u534A\u5C0E\u9AD4\u5668\u4EF6\u7684\u65B9\u6CD5\uFF0C\u8A72\u65B9\u6CD5\u5305\u62EC\uFF1A \u805A\u9170\u4E9E\u80FA\u8584\u819C\u7684\u4E3B\u8981\u88FD\u9020\u5546\u5305\u62EC\u675C\u90A6 \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09\uFF0CTory Industries \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09\uFF0CToyotape \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09\uFF0CSKC Kolon PI \uFF08\u9875\u9762\u5B58\u6863\u5907\u4EFD\uFF0C\u5B58\u4E8E\u4E92\u8054\u7F51\u6863\u6848\u9986\uFF09"@zh . . . "Chip Scale Package (CSP, engl.; zu deutsch Geh\u00E4use in der Gr\u00F6\u00DFenordnung des Die) ist ein Chipgeh\u00E4use von integrierten Schaltungen, bei dem das Geh\u00E4use maximal 20 % mehr Fl\u00E4che als das Die ausmacht, wozu ersichtlich die Anschl\u00FCsse f\u00FCr SMD-Best\u00FCckung ohne Bonding mit dem Die verbunden werden m\u00FCssen. Das CSP stellt somit eine Fortentwicklung des Ball Grid Array (BGA) dar, was auf Ideen von Mitarbeitern von Fujitsu und Hitachi Cable zur\u00FCckgeht und erstmals von Mitsubishi Electric realisiert wurde."@de . . . "\u041A\u043E\u0440\u043F\u0443\u0441 \u0437 \u0440\u043E\u0437\u043C\u0456\u0440\u0430\u043C\u0438, \u0431\u043B\u0438\u0437\u044C\u043A\u0438\u043C\u0438 \u0434\u043E \u0440\u043E\u0437\u043C\u0456\u0440\u0443 \u043A\u0440\u0438\u0441\u0442\u0430\u043B\u0430 (CSP, \u0430\u043D\u0433\u043B. Chip-scale package) \u2014 \u043E\u0434\u0438\u043D \u0437 \u0442\u0438\u043F\u0456\u0432 \u043A\u043E\u0440\u043F\u0443\u0441\u0443 \u0456\u043D\u0442\u0435\u0433\u0440\u043E\u0432\u0430\u043D\u043E\u0457 \u0441\u0445\u0435\u043C\u0438. \u0421\u043F\u043E\u0447\u0430\u0442\u043A\u0443 CSP \u0446\u0435 \u0431\u0443\u0432 \u043B\u0438\u0448\u0435 \u0430\u043A\u0440\u043E\u043D\u0456\u043C \u0434\u043B\u044F \u043D\u0430\u043F\u0440\u044F\u043C\u0443 \u0442\u0435\u0445\u043D\u043E\u043B\u043E\u0433\u0456\u0457 \u043A\u043E\u0440\u043F\u0443\u0441\u0443\u0432\u0430\u043D\u043D\u044F. \u041F\u043E\u0442\u0456\u043C \u0437\u043D\u0430\u0447\u0435\u043D\u043D\u044F \u0430\u0431\u0440\u0435\u0432\u0456\u0430\u0442\u0443\u0440\u0438 \u0431\u0443\u043B\u043E \u0441\u0442\u0430\u043D\u0434\u0430\u0440\u0442\u043E\u043C \u0437\u0430\u043A\u0440\u0456\u043F\u043B\u0435\u043D\u043E \u0437\u0430 \u043F\u0435\u0432\u043D\u0438\u043C \u0442\u0438\u043F\u043E\u043C. \u0423 \u0432\u0456\u0434\u043F\u043E\u0432\u0456\u0434\u043D\u043E\u0441\u0442\u0456 \u0437\u0456 \u0441\u0442\u0430\u043D\u0434\u0430\u0440\u0442\u043E\u043C J-STD-012, \u0434\u043B\u044F \u0442\u043E\u0433\u043E \u0449\u043E\u0431 \u043A\u0432\u0430\u043B\u0456\u0444\u0456\u043A\u0443\u0432\u0430\u0442\u0438\u0441\u044F \u044F\u043A CSP, \u043A\u043E\u0440\u043F\u0443\u0441 \u043F\u043E\u0432\u0438\u043D\u0435\u043D \u043F\u0435\u0440\u0435\u0432\u0438\u0449\u0443\u0432\u0430\u0442\u0438 \u043F\u043B\u043E\u0449\u0443 \u0447\u0438\u043F\u0430 \u043D\u0435 \u0431\u0456\u043B\u044C\u0448\u0435 \u043D\u0456\u0436 \u0432 1,2 \u0440\u0430\u0437\u0438. \u0429\u0435 \u043E\u0434\u0438\u043D \u043A\u0440\u0438\u0442\u0435\u0440\u0456\u0439, \u044F\u043A\u0438\u0439 \u0447\u0430\u0441\u0442\u043E \u0437\u0430\u0441\u0442\u043E\u0441\u043E\u0432\u0443\u0454\u0442\u044C\u0441\u044F, \u0449\u043E\u0431 \u043A\u0432\u0430\u043B\u0456\u0444\u0456\u043A\u0443\u0432\u0430\u0442\u0438 \u0446\u0456 \u043A\u043E\u0440\u043F\u0443\u0441\u0438, \u0454 \u043A\u0440\u043E\u043A \u043C\u0430\u0442\u0440\u0438\u0446\u0456 \u0432\u0438\u0432\u043E\u0434\u0456\u0432, \u044F\u043A\u0438\u0439 \u043F\u043E\u0432\u0438\u043D\u0435\u043D \u0431\u0443\u0442\u0438 \u043D\u0435 \u0431\u0456\u043B\u044C\u0448\u0435 1 \u043C\u043C."@uk . . . "Chip-scale package"@uk . . .