. "Bondov\u00E1n\u00ED (anglicky: Wire Bonding ) je metoda pevn\u00E9ho spojen\u00ED sou\u010D\u00E1stek (\u010Dip\u016F) s deskou plo\u0161n\u00E9ho spoje pomoc\u00ED jemn\u00FDch dr\u00E1tk\u016F obvykle ze zlata nebo hlin\u00EDku o vysok\u00E9 \u010Distot\u011B, p\u0159iva\u0159en\u00FDch pomoc\u00ED termokomprese, ultrazvukem nebo termosonicky ke kontaktn\u00ED plo\u0161ce.Bondov\u00E1n\u00ED se tak\u00E9 pou\u017E\u00EDv\u00E1 u spoj\u016F s po\u017Eadavkem na co nejmen\u0161\u00ED termoelektrick\u00E9 nap\u011Bt\u00ED, kter\u00E9 m\u016F\u017Ee vznikat p\u0159i spojen\u00ED kov\u016F. Bondov\u00E1n\u00EDm (p\u0159ev\u00E1\u017En\u011B zlat\u00FDm dr\u00E1tkem) vznik\u00E1 dlouhodob\u011B nejspolehliv\u011Bj\u0161\u00ED spojen\u00ED bez termick\u00FDch \u0161um\u016F. Metody: \n* Termokomprese \u2013 zlat\u00FD dr\u00E1tek, spojen\u00ED prob\u00EDh\u00E1 p\u016Fsoben\u00EDm tepla a tlaku \n* Ultrasonicky \u2013 hlin\u00EDkov\u00FD dr\u00E1tek, spojen\u00ED prob\u00EDh\u00E1 p\u016Fsoben\u00EDm tlaku a ultrazvuku \n* Termosonicky \u2013 kombinace tepla a ultrazvuku"@cs . "\u30EF\u30A4\u30E4\u30FB\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0\uFF08\u82F1\u8A9E: Wire Bonding\uFF09\u3068\u306F\u3001\u76F4\u5F84\u5341\u6570\u30DE\u30A4\u30AF\u30ED\u30E1\u30FC\u30C8\u30EB\u304B\u3089\u6570\u767E\u30DE\u30A4\u30AF\u30ED\u30E1\u30FC\u30C8\u30EB\u306E\u91D1\u3001\u30A2\u30EB\u30DF\u30CB\u30A6\u30E0\u3001\u9285\u306A\u3069\u306E\u30EF\u30A4\u30E4\u3092\u7528\u3044\u3066\u3001\u30C8\u30E9\u30F3\u30B8\u30B9\u30BF\u3001\u96C6\u7A4D\u56DE\u8DEF\u4E0A\u306E\u96FB\u6975\u3068\u3001\u30D7\u30EA\u30F3\u30C8\u57FA\u677F\u3001\u534A\u5C0E\u4F53\u30D1\u30C3\u30B1\u30FC\u30B8\u306E\u96FB\u6975\u306A\u3069\u3092\u3001\u96FB\u6C17\u7684\u306B\u63A5\u7D9A\u3059\u308B\u65B9\u6CD5\u3067\u3042\u308B\u3002\u96C6\u7A4D\u56DE\u8DEF\u3068\u305D\u306E\u4ED6\u306E\u96FB\u5B50\u90E8\u54C1\u3068\u306E\u63A5\u7D9A\u3084\u3001\u30D7\u30EA\u30F3\u30C8\u57FA\u677F\u540C\u58EB\u306E\u63A5\u7D9A\u3001\u96C6\u7A4D\u56DE\u8DEF\u5185\u90E8\u306E\u63A5\u7D9A\u306B\u7528\u3044\u3089\u308C\u308B\u3053\u3068\u3082\u3042\u308B\u3002 \u30EF\u30A4\u30E4\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0\u306F\u3001\u30B3\u30B9\u30C8\u304C\u4F4E\u304F\u3001\u81EA\u7531\u5EA6\u306E\u9AD8\u3044\u63A5\u7D9A\u6280\u8853\u3067\u3042\u308B\u3068\u8003\u3048\u3089\u308C\u3066\u304A\u308A\u3001\u534A\u5C0E\u4F53\u30D1\u30C3\u30B1\u30FC\u30B8\u3068\u96C6\u7A4D\u56DE\u8DEF\u306E\u63A5\u7D9A\u306E\u5927\u90E8\u5206\u304C\u30EF\u30A4\u30E4\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0\u3067\u884C\u308F\u308C\u3066\u3044\u308B\u3002"@ja . . . . . "Il wire bonding \u00E8 la tecnica principale per la realizzazione di interconnessioni fra i circuiti integrati (IC) e le schede per circuito stampato (PCB), durante la fabbricazione di . Il wire bonding pu\u00F2 essere anche utilizzato per collegare un circuito integrato ad altri componenti elettronici, per connettere tra loro diverse PCB e per interconnettere elettricamente un circuito integrato al package. Il wire bonding \u00E8 generalmente considerato la tecnologia di interconnessione pi\u00F9 flessibile e con un miglior rapporto costo-efficacia, e viene utilizzato durante le fasi di assemblaggio dei circuiti integrati nei packages per la grande maggioranza dei dispositivi microelettronici.I fili comunemente utilizzati in questa tecnica sono realizzati in oro, alluminio, o rame. I diametri dei fili partono da 15 micron e possono raggiungere parecchie centinaia di micron per applicazioni di elevata potenza. Ci sono due tipologie principali di connessioni a filo: \n* (a \"sfera\") \n* (a \"cuneo\") Le connessioni a sfera sono limitate ai fili di oro e di rame e richiedono, solitamente, del calore. Le connessioni a cuneo possono usare tanto fili d'oro quanto fili di alluminio senza utilizzare necessariamente fonti di calore che riscaldino il substrato sul quale verr\u00E0 effettuata la saldatura. Il wedge bonding, infatti, pu\u00F2 essere correttamente realizzato anche mantenendo il substrato (solitamente allumina o impasti di teflon-vetro) a temperatura ambiente, oscillante solitamente fra i 23 \u00B0C ed i 26 \u00B0C.In tutti e due i tipi di wire bonding, il filo viene fissato su entrambe le estremit\u00E0 usando combinazioni di potenza e durata dell'impulso ad ultrasuoni solitamente utilizzato nel wedge bonding."@it . . . "Das Drahtbonden (von engl. bond \u2013 \u201EVerbindung\u201C, \u201EHaftung\u201C) bezeichnet in der Aufbau- und Verbindungstechnik einen Verfahrensschritt, bei dem mittels d\u00FCnner Dr\u00E4hte (Bonddraht) die Anschl\u00FCsse eines integrierten Schaltkreises oder eines diskreten Halbleiters (z. B. Transistor, Leuchtdiode oder Photodiode) mit den elektrischen Anschl\u00FCssen anderer Bauteile oder des Geh\u00E4uses verbunden werden. Der Vorgang des Aufl\u00F6tens der r\u00FCckseitigen Kontakte eines Chips ohne Draht wird im Gegensatz dazu als Chipbonden bezeichnet."@de . . "Drahtbonden"@de . . . . "Wire bonding \u00E9s un proc\u00E9s d'interconnexi\u00F3 entre un circuit integrat o dispositiu semiconductor i el seu encapsulat, durant el proc\u00E9s de fabricaci\u00F3 del dispositiu semiconductor. Tamb\u00E9 es pot emprar per interconnectar d'altres variants com circuit integrat a PCB o PCB a PCB."@ca . . . . . . . . . "Bondov\u00E1n\u00ED"@cs . . "C\u00E2blage par fil"@fr . . . . . . . . . . . . "Um fio de liga\u00E7\u00E3o (ou bond wire) \u00E9 um fio met\u00E1lico usado para fazer interconex\u00F5es entre um microchip e outros componentes eletr\u00F4nicos, como parte do processo de fabrica\u00E7\u00E3o de dispositivos semicondutores (microsoldagem). A microsoldagem \u00E9 geralmente considerada como a tecnologia de interconex\u00E3o mais barata e flex\u00EDvel, e \u00E9 usada na grande maioria dos encapsulamentos de semicondutores."@pt . . . . . . . . . "Das Drahtbonden (von engl. bond \u2013 \u201EVerbindung\u201C, \u201EHaftung\u201C) bezeichnet in der Aufbau- und Verbindungstechnik einen Verfahrensschritt, bei dem mittels d\u00FCnner Dr\u00E4hte (Bonddraht) die Anschl\u00FCsse eines integrierten Schaltkreises oder eines diskreten Halbleiters (z. B. Transistor, Leuchtdiode oder Photodiode) mit den elektrischen Anschl\u00FCssen anderer Bauteile oder des Geh\u00E4uses verbunden werden. Der Vorgang des Aufl\u00F6tens der r\u00FCckseitigen Kontakte eines Chips ohne Draht wird im Gegensatz dazu als Chipbonden bezeichnet."@de . "Wire bonding"@en . . . . . . . . . . . . . . "\u30EF\u30A4\u30E4\u30FB\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0\uFF08\u82F1\u8A9E: Wire Bonding\uFF09\u3068\u306F\u3001\u76F4\u5F84\u5341\u6570\u30DE\u30A4\u30AF\u30ED\u30E1\u30FC\u30C8\u30EB\u304B\u3089\u6570\u767E\u30DE\u30A4\u30AF\u30ED\u30E1\u30FC\u30C8\u30EB\u306E\u91D1\u3001\u30A2\u30EB\u30DF\u30CB\u30A6\u30E0\u3001\u9285\u306A\u3069\u306E\u30EF\u30A4\u30E4\u3092\u7528\u3044\u3066\u3001\u30C8\u30E9\u30F3\u30B8\u30B9\u30BF\u3001\u96C6\u7A4D\u56DE\u8DEF\u4E0A\u306E\u96FB\u6975\u3068\u3001\u30D7\u30EA\u30F3\u30C8\u57FA\u677F\u3001\u534A\u5C0E\u4F53\u30D1\u30C3\u30B1\u30FC\u30B8\u306E\u96FB\u6975\u306A\u3069\u3092\u3001\u96FB\u6C17\u7684\u306B\u63A5\u7D9A\u3059\u308B\u65B9\u6CD5\u3067\u3042\u308B\u3002\u96C6\u7A4D\u56DE\u8DEF\u3068\u305D\u306E\u4ED6\u306E\u96FB\u5B50\u90E8\u54C1\u3068\u306E\u63A5\u7D9A\u3084\u3001\u30D7\u30EA\u30F3\u30C8\u57FA\u677F\u540C\u58EB\u306E\u63A5\u7D9A\u3001\u96C6\u7A4D\u56DE\u8DEF\u5185\u90E8\u306E\u63A5\u7D9A\u306B\u7528\u3044\u3089\u308C\u308B\u3053\u3068\u3082\u3042\u308B\u3002 \u30EF\u30A4\u30E4\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0\u306F\u3001\u30B3\u30B9\u30C8\u304C\u4F4E\u304F\u3001\u81EA\u7531\u5EA6\u306E\u9AD8\u3044\u63A5\u7D9A\u6280\u8853\u3067\u3042\u308B\u3068\u8003\u3048\u3089\u308C\u3066\u304A\u308A\u3001\u534A\u5C0E\u4F53\u30D1\u30C3\u30B1\u30FC\u30B8\u3068\u96C6\u7A4D\u56DE\u8DEF\u306E\u63A5\u7D9A\u306E\u5927\u90E8\u5206\u304C\u30EF\u30A4\u30E4\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0\u3067\u884C\u308F\u308C\u3066\u3044\u308B\u3002"@ja . . . "Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz."@en . . "Um fio de liga\u00E7\u00E3o (ou bond wire) \u00E9 um fio met\u00E1lico usado para fazer interconex\u00F5es entre um microchip e outros componentes eletr\u00F4nicos, como parte do processo de fabrica\u00E7\u00E3o de dispositivos semicondutores (microsoldagem). A microsoldagem \u00E9 geralmente considerada como a tecnologia de interconex\u00E3o mais barata e flex\u00EDvel, e \u00E9 usada na grande maioria dos encapsulamentos de semicondutores."@pt . . . . . . "Wire bonding"@ca . . "Fio de liga\u00E7\u00E3o"@pt . . . . . . . "\u0420\u0430\u0441\u043F\u0430\u0439\u043A\u0430 \u0432\u044B\u0432\u043E\u0434\u043E\u0432"@ru . . . . . . . . . . "Dans le domaine des semi-conducteurs, le c\u00E2blage par fil ou pontage (traduction de wire bonding) est une des techniques utilis\u00E9es pour effectuer les connexions \u00E9lectriques entre le bo\u00EEtier et le die d'un circuit int\u00E9gr\u00E9. Le c\u00E2blage est simplement r\u00E9alis\u00E9 par un fil (ou pont) soud\u00E9 entre les deux plots de connexion pr\u00E9vus \u00E0 cet usage sur chacun des \u00E9l\u00E9ments. La soudure est g\u00E9n\u00E9ralement r\u00E9alis\u00E9e par ultrasons. Le mat\u00E9riau du fil est de l'aluminium, de l'or ou du cuivre. Le diam\u00E8tre du fil est de l'ordre de 20 \u00B5m."@fr . . . . . . "Bondov\u00E1n\u00ED (anglicky: Wire Bonding ) je metoda pevn\u00E9ho spojen\u00ED sou\u010D\u00E1stek (\u010Dip\u016F) s deskou plo\u0161n\u00E9ho spoje pomoc\u00ED jemn\u00FDch dr\u00E1tk\u016F obvykle ze zlata nebo hlin\u00EDku o vysok\u00E9 \u010Distot\u011B, p\u0159iva\u0159en\u00FDch pomoc\u00ED termokomprese, ultrazvukem nebo termosonicky ke kontaktn\u00ED plo\u0161ce.Bondov\u00E1n\u00ED se tak\u00E9 pou\u017E\u00EDv\u00E1 u spoj\u016F s po\u017Eadavkem na co nejmen\u0161\u00ED termoelektrick\u00E9 nap\u011Bt\u00ED, kter\u00E9 m\u016F\u017Ee vznikat p\u0159i spojen\u00ED kov\u016F. Bondov\u00E1n\u00EDm (p\u0159ev\u00E1\u017En\u011B zlat\u00FDm dr\u00E1tkem) vznik\u00E1 dlouhodob\u011B nejspolehliv\u011Bj\u0161\u00ED spojen\u00ED bez termick\u00FDch \u0161um\u016F. Metody:"@cs . . . . "\u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643"@ar . . "El soldado de cables es el m\u00E9todo m\u00E1s usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del m\u00E9todo de soldado de cables no se limita s\u00F3lo a este tipo de conexiones, ya que tambi\u00E9n se puede utilizar para conectar varios circuitos integrados entre s\u00ED. El m\u00E9todo de soldado de cables consiste en crear cables de interconexi\u00F3n muy finos desde los contactos del chip hasta los contactos existentes en la PCB, o en el caso del empaquetado 3D, entre los contactos de un chip hasta los contactos de otro chip."@es . . . "Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz."@en . . . . . . . . . . . "Il wire bonding \u00E8 la tecnica principale per la realizzazione di interconnessioni fra i circuiti integrati (IC) e le schede per circuito stampato (PCB), durante la fabbricazione di . Il wire bonding pu\u00F2 essere anche utilizzato per collegare un circuito integrato ad altri componenti elettronici, per connettere tra loro diverse PCB e per interconnettere elettricamente un circuito integrato al package. Il wire bonding \u00E8 generalmente considerato la tecnologia di interconnessione pi\u00F9 flessibile e con un miglior rapporto costo-efficacia, e viene utilizzato durante le fasi di assemblaggio dei circuiti integrati nei packages per la grande maggioranza dei dispositivi microelettronici.I fili comunemente utilizzati in questa tecnica sono realizzati in oro, alluminio, o rame. I diametri dei fili parton"@it . . "El soldado de cables es el m\u00E9todo m\u00E1s usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del m\u00E9todo de soldado de cables no se limita s\u00F3lo a este tipo de conexiones, ya que tambi\u00E9n se puede utilizar para conectar varios circuitos integrados entre s\u00ED. El m\u00E9todo de soldado de cables consiste en crear cables de interconexi\u00F3n muy finos desde los contactos del chip hasta los contactos existentes en la PCB, o en el caso del empaquetado 3D, entre los contactos de un chip hasta los contactos de otro chip. Estos cables de uni\u00F3n suelen estar fabricados de aluminio, cobre u oro. En cuanto a las uniones, estas pueden ser de dos tipos b\u00E1sicamente: \n* Uniones mediante bolas (con aire en su interior), generalmente usadas para conectar el cable en el origen. \n* Uniones en forma de cu\u00F1a, usadas para conectar el cable con la zona de contacto del destino."@es . "\u0420\u0430\u0441\u043F\u0430\u0439\u043A\u0430 \u0432\u044B\u0432\u043E\u0434\u043E\u0432 (\u0430\u043D\u0433\u043B. Wire bonding) \u2014 \u043C\u0435\u0442\u043E\u0434 \u043E\u0441\u0443\u0449\u0435\u0441\u0442\u0432\u043B\u0435\u043D\u0438\u044F \u044D\u043B\u0435\u043A\u0442\u0440\u0438\u0447\u0435\u0441\u043A\u043E\u0433\u043E \u043C\u0435\u0436\u0441\u043E\u0435\u0434\u0438\u043D\u0435\u043D\u0438\u044F \u043F\u0440\u043E\u0432\u043E\u0434\u043D\u0438\u043A\u0430\u043C\u0438 \u043E\u0441\u0442\u043E\u0432\u0430 \u0443\u0441\u0442\u0440\u043E\u0439\u0441\u0442\u0432\u0430 (\u0432\u043D\u0435\u0448\u043D\u0438\u0445 \u0432\u044B\u0432\u043E\u0434\u043E\u0432, \u043F\u043B\u0430\u0442\u044B, \u043A\u043E\u0440\u043F\u0443\u0441\u0430) \u0438 \u0447\u0438\u043F\u0430 \u043A\u0440\u0438\u0441\u0442\u0430\u043B\u043B\u0430, \u043E\u0431\u0435\u0441\u043F\u0435\u0447\u0438\u0432\u0430\u044E\u0449\u0438\u0435 \u043C\u0435\u0445\u0430\u043D\u0438\u0447\u0435\u0441\u043A\u0438\u0439 \u0438 \u044D\u043B\u0435\u043A\u0442\u0440\u0438\u0447\u0435\u0441\u043A\u0438\u0439 \u043A\u043E\u043D\u0442\u0430\u043A\u0442\u044B. \u041E\u0434\u0438\u043D \u0438\u0437 \u0432\u0430\u0440\u0438\u0430\u043D\u0442\u043E\u0432 \u043A\u043E\u0440\u043F\u0443\u0441\u0438\u0440\u043E\u0432\u0430\u043D\u0438\u044F \u0438\u043D\u0442\u0435\u0433\u0440\u0430\u043B\u044C\u043D\u044B\u0445 \u0441\u0445\u0435\u043C. \u0414\u043B\u044F \u043A\u0440\u0435\u043F\u043B\u0435\u043D\u0438\u044F \u043F\u0440\u043E\u0432\u043E\u0434\u043D\u0438\u043A\u043E\u0432 \u043F\u0440\u0438\u043C\u0435\u043D\u044F\u0435\u0442\u0441\u044F \u043B\u0430\u0437\u0435\u0440\u043D\u0430\u044F, \u0443\u043B\u044C\u0442\u0440\u0430\u0437\u0432\u0443\u043A\u043E\u0432\u0430\u044F \u0441\u0432\u0430\u0440\u043A\u0430."@ru . . . . "Soldado de cables"@es . . "Wire bonding \u00E9s un proc\u00E9s d'interconnexi\u00F3 entre un circuit integrat o dispositiu semiconductor i el seu encapsulat, durant el proc\u00E9s de fabricaci\u00F3 del dispositiu semiconductor. Tamb\u00E9 es pot emprar per interconnectar d'altres variants com circuit integrat a PCB o PCB a PCB."@ca . . "\u6253\u7DDA\u63A5\u5408(\u82F1\u8A9E\uFF1AWire bonding)\u662F\u4E00\u7A2E\u7A4D\u9AD4\u96FB\u8DEF\u5C01\u88DD\u7522\u696D\u4E2D\u7684\u88FD\u7A0B\u4E4B\u4E00\uFF0C\u5229\u7528\u7DDA\u5F9115-50\u5FAE\u7C73\u7684\u91D1\u5C6C\u7DDA\u6750\u5C07\u6676\u7247(chip)\u53CA\u5C0E\u7DDA\u67B6(lead frame)\u9023\u63A5\u8D77\u4F86\u7684\u6280\u8853\uFF0C\u4F7F\u5FAE\u5C0F\u7684\u6676\u7247\u5F97\u4EE5\u8207\u5916\u9762\u7684\u96FB\u8DEF\u505A\u6E9D\u901A\uFF0C\u800C\u4E0D\u9700\u8981\u589E\u52A0\u592A\u591A\u7684\u9762\u7A4D\u3002\u5176\u4ED6\u985E\u4F3C\u7684\u63A5\u5408\u6280\u8853\u5982\u8986\u6676\u63A5\u5408(Flip-chip)\u6216(Tape-Automated Bonding, TAB)\u90FD\u5DF2\u7D93\u8D8A\u8DA8\u6210\u719F\uFF0C\u96D6\u7136\u8986\u6676\u63A5\u5408\u9010\u6F38\u5728\u541E\u98DF\u6253\u7DDA\u63A5\u5408\u7684\u5E02\u5834\uFF0C\u4F46\u76EE\u524D\u4ECD\u4EE5\u6253\u7DDA\u63A5\u5408\u70BA\u6700\u5E38\u898B\u7684\u63A5\u5408\u6280\u8853\u3002"@zh . . . . . . . "\u6253\u7DDA\u63A5\u5408(\u82F1\u8A9E\uFF1AWire bonding)\u662F\u4E00\u7A2E\u7A4D\u9AD4\u96FB\u8DEF\u5C01\u88DD\u7522\u696D\u4E2D\u7684\u88FD\u7A0B\u4E4B\u4E00\uFF0C\u5229\u7528\u7DDA\u5F9115-50\u5FAE\u7C73\u7684\u91D1\u5C6C\u7DDA\u6750\u5C07\u6676\u7247(chip)\u53CA\u5C0E\u7DDA\u67B6(lead frame)\u9023\u63A5\u8D77\u4F86\u7684\u6280\u8853\uFF0C\u4F7F\u5FAE\u5C0F\u7684\u6676\u7247\u5F97\u4EE5\u8207\u5916\u9762\u7684\u96FB\u8DEF\u505A\u6E9D\u901A\uFF0C\u800C\u4E0D\u9700\u8981\u589E\u52A0\u592A\u591A\u7684\u9762\u7A4D\u3002\u5176\u4ED6\u985E\u4F3C\u7684\u63A5\u5408\u6280\u8853\u5982\u8986\u6676\u63A5\u5408(Flip-chip)\u6216(Tape-Automated Bonding, TAB)\u90FD\u5DF2\u7D93\u8D8A\u8DA8\u6210\u719F\uFF0C\u96D6\u7136\u8986\u6676\u63A5\u5408\u9010\u6F38\u5728\u541E\u98DF\u6253\u7DDA\u63A5\u5408\u7684\u5E02\u5834\uFF0C\u4F46\u76EE\u524D\u4ECD\u4EE5\u6253\u7DDA\u63A5\u5408\u70BA\u6700\u5E38\u898B\u7684\u63A5\u5408\u6280\u8853\u3002"@zh . "\u0420\u0430\u0441\u043F\u0430\u0439\u043A\u0430 \u0432\u044B\u0432\u043E\u0434\u043E\u0432 (\u0430\u043D\u0433\u043B. Wire bonding) \u2014 \u043C\u0435\u0442\u043E\u0434 \u043E\u0441\u0443\u0449\u0435\u0441\u0442\u0432\u043B\u0435\u043D\u0438\u044F \u044D\u043B\u0435\u043A\u0442\u0440\u0438\u0447\u0435\u0441\u043A\u043E\u0433\u043E \u043C\u0435\u0436\u0441\u043E\u0435\u0434\u0438\u043D\u0435\u043D\u0438\u044F \u043F\u0440\u043E\u0432\u043E\u0434\u043D\u0438\u043A\u0430\u043C\u0438 \u043E\u0441\u0442\u043E\u0432\u0430 \u0443\u0441\u0442\u0440\u043E\u0439\u0441\u0442\u0432\u0430 (\u0432\u043D\u0435\u0448\u043D\u0438\u0445 \u0432\u044B\u0432\u043E\u0434\u043E\u0432, \u043F\u043B\u0430\u0442\u044B, \u043A\u043E\u0440\u043F\u0443\u0441\u0430) \u0438 \u0447\u0438\u043F\u0430 \u043A\u0440\u0438\u0441\u0442\u0430\u043B\u043B\u0430, \u043E\u0431\u0435\u0441\u043F\u0435\u0447\u0438\u0432\u0430\u044E\u0449\u0438\u0435 \u043C\u0435\u0445\u0430\u043D\u0438\u0447\u0435\u0441\u043A\u0438\u0439 \u0438 \u044D\u043B\u0435\u043A\u0442\u0440\u0438\u0447\u0435\u0441\u043A\u0438\u0439 \u043A\u043E\u043D\u0442\u0430\u043A\u0442\u044B. \u041E\u0434\u0438\u043D \u0438\u0437 \u0432\u0430\u0440\u0438\u0430\u043D\u0442\u043E\u0432 \u043A\u043E\u0440\u043F\u0443\u0441\u0438\u0440\u043E\u0432\u0430\u043D\u0438\u044F \u0438\u043D\u0442\u0435\u0433\u0440\u0430\u043B\u044C\u043D\u044B\u0445 \u0441\u0445\u0435\u043C. \u0414\u043B\u044F \u043A\u0440\u0435\u043F\u043B\u0435\u043D\u0438\u044F \u043F\u0440\u043E\u0432\u043E\u0434\u043D\u0438\u043A\u043E\u0432 \u043F\u0440\u0438\u043C\u0435\u043D\u044F\u0435\u0442\u0441\u044F \u043B\u0430\u0437\u0435\u0440\u043D\u0430\u044F, \u0443\u043B\u044C\u0442\u0440\u0430\u0437\u0432\u0443\u043A\u043E\u0432\u0430\u044F \u0441\u0432\u0430\u0440\u043A\u0430."@ru . "19565"^^ . "Dans le domaine des semi-conducteurs, le c\u00E2blage par fil ou pontage (traduction de wire bonding) est une des techniques utilis\u00E9es pour effectuer les connexions \u00E9lectriques entre le bo\u00EEtier et le die d'un circuit int\u00E9gr\u00E9. Le c\u00E2blage est simplement r\u00E9alis\u00E9 par un fil (ou pont) soud\u00E9 entre les deux plots de connexion pr\u00E9vus \u00E0 cet usage sur chacun des \u00E9l\u00E9ments. La soudure est g\u00E9n\u00E9ralement r\u00E9alis\u00E9e par ultrasons. Le mat\u00E9riau du fil est de l'aluminium, de l'or ou du cuivre. Le diam\u00E8tre du fil est de l'ordre de 20 \u00B5m."@fr . . "\u6253\u7DDA\u63A5\u5408"@zh . "\u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643 \u0647\u064A \u062A\u0642\u0646\u064A\u0629 \u0645\u0633\u062A\u062E\u062F\u0645\u0629 \u0641\u064A \u0627\u0644\u0635\u0646\u0627\u0639\u0627\u062A \u0627\u0644\u0625\u0644\u0643\u062A\u0631\u0648\u0646\u064A\u0629 \u0645\u0646 \u0623\u062C\u0644 \u0648\u0635\u0644 \u0628\u064A\u0646 \u062F\u0627\u0631\u0629 \u0645\u062A\u0643\u0627\u0645\u0644\u0629 \u0623\u0648 \u0623\u064A \u062C\u0647\u0627\u0632 \u0634\u0628\u0647 \u0645\u0648\u0635\u0644 \u0622\u062E\u0631 \u0645\u0639 \u0627\u0644\u0645\u0643\u0648\u0646\u0627\u062A \u0627\u0644\u0623\u062E\u0631\u0649 \u0623\u062B\u0646\u0627\u0621 \u0627\u0644\u0645\u0631\u0627\u062D\u0644 \u0627\u0644\u0646\u0647\u0627\u0626\u064A\u0629 \u0645\u0646 \u062A\u0635\u0646\u064A\u0639 \u0646\u0628\u0627\u0626\u0637 \u0623\u0634\u0628\u0627\u0647 \u0627\u0644\u0645\u0648\u0635\u0644\u0627\u062A. \u062A\u0639\u062F \u0645\u0631\u062D\u0644\u0629 \u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643 \u0645\u0646 \u0627\u0644\u0639\u0645\u0644\u064A\u0627\u062A \u0627\u0644\u062F\u0642\u064A\u0642\u0629 \u0641\u064A \u0635\u0646\u0627\u0639\u0629 \u0627\u0644\u0625\u0644\u0643\u062A\u0631\u0648\u0646\u064A\u0627\u062A \u0648\u0645\u0646 \u0623\u0643\u062B\u0631\u0647\u0627 \u0643\u0644\u0641\u0629. \u0639\u0646\u062F \u0625\u062C\u0631\u0627\u0621 \u0627\u0644\u0639\u0645\u0644\u064A\u0629 \u062A\u0631\u0627\u0639\u0649 \u0627\u0644\u0634\u0631\u0648\u0637 \u0627\u0644\u0623\u062E\u0631\u0649 \u0645\u0646 \u0645\u064A\u0632\u0627\u062A \u0627\u0644\u062F\u0627\u0631\u0627\u062A\u060C \u0641\u0639\u0646\u062F \u062A\u0635\u0645\u064A\u0645 \u0645\u0644\u0627\u0626\u0645 \u0644\u0644\u062F\u0627\u0631\u0629\u060C \u064A\u0645\u0643\u0646 \u0623\u0646 \u0627\u0633\u062A\u062E\u062F\u0627\u0645 \u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643 \u0639\u0646\u062F \u062A\u0648\u062A\u0631\u0627\u062A \u0641\u0648\u0642 100 GHz."@ar . "230283"^^ . . "\u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643 \u0647\u064A \u062A\u0642\u0646\u064A\u0629 \u0645\u0633\u062A\u062E\u062F\u0645\u0629 \u0641\u064A \u0627\u0644\u0635\u0646\u0627\u0639\u0627\u062A \u0627\u0644\u0625\u0644\u0643\u062A\u0631\u0648\u0646\u064A\u0629 \u0645\u0646 \u0623\u062C\u0644 \u0648\u0635\u0644 \u0628\u064A\u0646 \u062F\u0627\u0631\u0629 \u0645\u062A\u0643\u0627\u0645\u0644\u0629 \u0623\u0648 \u0623\u064A \u062C\u0647\u0627\u0632 \u0634\u0628\u0647 \u0645\u0648\u0635\u0644 \u0622\u062E\u0631 \u0645\u0639 \u0627\u0644\u0645\u0643\u0648\u0646\u0627\u062A \u0627\u0644\u0623\u062E\u0631\u0649 \u0623\u062B\u0646\u0627\u0621 \u0627\u0644\u0645\u0631\u0627\u062D\u0644 \u0627\u0644\u0646\u0647\u0627\u0626\u064A\u0629 \u0645\u0646 \u062A\u0635\u0646\u064A\u0639 \u0646\u0628\u0627\u0626\u0637 \u0623\u0634\u0628\u0627\u0647 \u0627\u0644\u0645\u0648\u0635\u0644\u0627\u062A. \u062A\u0639\u062F \u0645\u0631\u062D\u0644\u0629 \u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643 \u0645\u0646 \u0627\u0644\u0639\u0645\u0644\u064A\u0627\u062A \u0627\u0644\u062F\u0642\u064A\u0642\u0629 \u0641\u064A \u0635\u0646\u0627\u0639\u0629 \u0627\u0644\u0625\u0644\u0643\u062A\u0631\u0648\u0646\u064A\u0627\u062A \u0648\u0645\u0646 \u0623\u0643\u062B\u0631\u0647\u0627 \u0643\u0644\u0641\u0629. \u0639\u0646\u062F \u0625\u062C\u0631\u0627\u0621 \u0627\u0644\u0639\u0645\u0644\u064A\u0629 \u062A\u0631\u0627\u0639\u0649 \u0627\u0644\u0634\u0631\u0648\u0637 \u0627\u0644\u0623\u062E\u0631\u0649 \u0645\u0646 \u0645\u064A\u0632\u0627\u062A \u0627\u0644\u062F\u0627\u0631\u0627\u062A\u060C \u0641\u0639\u0646\u062F \u062A\u0635\u0645\u064A\u0645 \u0645\u0644\u0627\u0626\u0645 \u0644\u0644\u062F\u0627\u0631\u0629\u060C \u064A\u0645\u0643\u0646 \u0623\u0646 \u0627\u0633\u062A\u062E\u062F\u0627\u0645 \u0631\u0628\u0637 \u0627\u0644\u0623\u0633\u0644\u0627\u0643 \u0639\u0646\u062F \u062A\u0648\u062A\u0631\u0627\u062A \u0641\u0648\u0642 100 GHz."@ar . "\u30EF\u30A4\u30E4\u30FB\u30DC\u30F3\u30C7\u30A3\u30F3\u30B0"@ja . "Wire bonding"@it . . "1115520574"^^ . . . . . . . .