Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil.
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| - Soldadura per refusió (ca)
- Pájení přetavením (cs)
- Reflow-Löten (de)
- Soldadura por refusión (es)
- Saldatura per rifusione (it)
- リフロー (ja)
- Reflow soldering (en)
- 回流焊接 (zh)
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| - La soldadura per refusió és el procés en què la pasta de soldar és usada per unir un o diversos components electrònics als seus pads de contacte en una placa de circuit imprès, mitjançant l'aplicació de calor o radiacció infraroja per etapes de diferents intensitats, que poden ser programades prèviament. És el mètode més usat per soldar components de muntatge superficial en plaques de circuit imprès. L'objectiu del procés és fondre la soldadura i escalfar les superfícies que es desitgen unir, tot això sense sobreescalfar o danyar els components electrònics. (ca)
- Pájení přetavením je jeden ze způsobů měkkého pájení v elektrotechnice. Při výrobě elektronických zařízení je jedním z nejpoužívanějších způsobů pájení SMD součástek. Také při výrobě hybridních integrovaných obvodů je to nejdůležitější postup. (cs)
- Der Begriff Reflow-Löten oder Wiederaufschmelzlöten (engl.: reflow soldering) bezeichnet ein in der Elektrotechnik gängiges Weichlötverfahren zum Löten von SMD-Bauteilen. Bei der Herstellung von Dickschicht-Hybridschaltungen ist es das häufigste Lötverfahren. (de)
- La saldatura per rifusione è un processo in cui viene utilizzata una pasta saldante (una miscela di stagno in polvere e flussante) per fissare temporaneamente uno o più componenti elettrici ai loro punti di contatto, dopo di che l'intero assemblaggio viene sottoposto a calore controllato, che fonde la lega e salda permanentemente i componenti. La fusione può essere completata in appositi forni, utilizzando lampade ad infrarossi oppure con saldatori ad aria calda, lavorando singolarmente ogni componente, portando la temparatura a circa 250 °C. (it)
- 回流焊接是指利用焊膏（由焊料和助焊劑混合而成的混合物）將一或多個電子元件連接到接觸墊上之後，透過控制加溫來熔化焊料以達到永久接合，可以用、或熱風槍等不同加溫方式來進行焊接。 回流焊接是表面黏著技術（SMT）將電子元件黏接至印刷電路板上最常使用的方法，另一種方式則是透過通孔插裝（THT）來連接電子元件。通孔插裝為將電路板上既有的孔洞填入焊膏，將接腳插入焊膏並把電子元件嵌至板上進行軟釺焊。由於波焊接（Wave soldering）較便宜且簡單，所以回流焊接基本上不會運用在通孔插裝的電路板上。當運用於同時包含SMT和THT元件的電路板時，通孔回流焊接（Through-hole reflow）能取代波焊接，並可有效降低組裝成本。 回流焊接的程序目的在於逐步熔化焊料與緩慢加熱連接介面，避免急速加熱而導致電子元件的損壞。在傳統的回流焊接過程中，通常分為四個階段，稱為「區（Zone）」，每一個區都擁有各自的溫度曲線：「預熱」、「浸熱」、「回流」與「冷却」。 (zh)
- Se conoce como soldadura por refusión o de reflow (término inglés sin traducción) al proceso en que la pasta de soldar es usada para unir uno o varios componentes electrónicos a sus patillas de contacto en la placa de circuito impreso mediante la aplicación de calor o radiación infrarroja por etapas de distinta intensidad que pueden ser programadas en la maquinaria de fabricación. (es)
- Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. (en)
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| - La soldadura per refusió és el procés en què la pasta de soldar és usada per unir un o diversos components electrònics als seus pads de contacte en una placa de circuit imprès, mitjançant l'aplicació de calor o radiacció infraroja per etapes de diferents intensitats, que poden ser programades prèviament. És el mètode més usat per soldar components de muntatge superficial en plaques de circuit imprès. L'objectiu del procés és fondre la soldadura i escalfar les superfícies que es desitgen unir, tot això sense sobreescalfar o danyar els components electrònics. (ca)
- Pájení přetavením je jeden ze způsobů měkkého pájení v elektrotechnice. Při výrobě elektronických zařízení je jedním z nejpoužívanějších způsobů pájení SMD součástek. Také při výrobě hybridních integrovaných obvodů je to nejdůležitější postup. (cs)
- Der Begriff Reflow-Löten oder Wiederaufschmelzlöten (engl.: reflow soldering) bezeichnet ein in der Elektrotechnik gängiges Weichlötverfahren zum Löten von SMD-Bauteilen. Bei der Herstellung von Dickschicht-Hybridschaltungen ist es das häufigste Lötverfahren. (de)
- Se conoce como soldadura por refusión o de reflow (término inglés sin traducción) al proceso en que la pasta de soldar es usada para unir uno o varios componentes electrónicos a sus patillas de contacto en la placa de circuito impreso mediante la aplicación de calor o radiación infrarroja por etapas de distinta intensidad que pueden ser programadas en la maquinaria de fabricación. La soldadura de refusión es el método más usado para soldar componentes de montaje superficial a la placa de circuito impreso. El objetivo del proceso de reflujo es fundir la soldadura y calentar las superficies que se desean unir, todo esto sin sobrecalentar o dañar los componentes electrónicos. (es)
- Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or (unconventionally) by soldering individual joints with a desoldering hot air pencil. Reflow soldering with long industrial convection ovens is the preferred method of soldering surface mount technology components or SMT to a printed circuit board or PCB. Each segment of the oven has a regulated temperature, according to the specific thermal requirements of each assembly. Reflow ovens meant specifically for the soldering of surface mount components may also be used for through-hole components by filling the holes with solder paste and inserting the component leads through the paste. Wave soldering however, has been the common method of soldering multi-leaded through-hole components onto a circuit board designed for surface-mount components. When used on boards containing a mix of SMT and plated through-hole (PTH) components, through-hole reflow, when achievable by specifically modified paste stencils, may allow for the wave soldering step to be eliminated from the assembly process, potentially reducing assembly costs. While this may be said of lead-tin solder pastes used previously, lead-free solder alloys such as SAC present a challenge in terms of the limits of oven temperature profile adjustment and requirements of specialized through-hole components that must be hand soldered with solder wire or cannot reasonably withstand the high temperatures directed at circuit boards as they travel on the conveyor of the reflow oven. The reflow soldering of through-hole components using solder paste in a convection oven process is called intrusive soldering. The goal of the reflow process is for the solder paste to reach the eutectic temperature at which the particular solder alloy undergoes a phase change to a liquid or molten state. At this specific temperature range, the molten alloy demonstrates properties of adhesion. Molten solder alloy behaves much as water, with properties of cohesion and adhesion. With sufficient flux, in the state of liquidus, molten solder alloys will exhibit a characteristic called "wetting." Wetting is a property of the alloy when within its specific eutectic temperature range. Wetting is a necessary condition for the formation of solder joints that meet the criteria as "acceptable" or "target" conditions, while "non-conforming" is considered defective according to IPC. The reflow oven temperature profile is suited for characteristics of a particular circuit board assembly, the size and depth of the ground plane layer within the board, the number of layers within the board, the number and size of the components, for example. The temperature profile for a particular circuit board will allow for reflow of solder onto the adjoining surfaces, without overheating and damaging the electrical components beyond their temperature tolerance. In the conventional reflow soldering process, there are usually four stages, called "zones", each having a distinct thermal profile: preheat, thermal soak (often shortened to just soak), reflow, and cooling. (en)
- La saldatura per rifusione è un processo in cui viene utilizzata una pasta saldante (una miscela di stagno in polvere e flussante) per fissare temporaneamente uno o più componenti elettrici ai loro punti di contatto, dopo di che l'intero assemblaggio viene sottoposto a calore controllato, che fonde la lega e salda permanentemente i componenti. La fusione può essere completata in appositi forni, utilizzando lampade ad infrarossi oppure con saldatori ad aria calda, lavorando singolarmente ogni componente, portando la temparatura a circa 250 °C. (it)
- 回流焊接是指利用焊膏（由焊料和助焊劑混合而成的混合物）將一或多個電子元件連接到接觸墊上之後，透過控制加溫來熔化焊料以達到永久接合，可以用、或熱風槍等不同加溫方式來進行焊接。 回流焊接是表面黏著技術（SMT）將電子元件黏接至印刷電路板上最常使用的方法，另一種方式則是透過通孔插裝（THT）來連接電子元件。通孔插裝為將電路板上既有的孔洞填入焊膏，將接腳插入焊膏並把電子元件嵌至板上進行軟釺焊。由於波焊接（Wave soldering）較便宜且簡單，所以回流焊接基本上不會運用在通孔插裝的電路板上。當運用於同時包含SMT和THT元件的電路板時，通孔回流焊接（Through-hole reflow）能取代波焊接，並可有效降低組裝成本。 回流焊接的程序目的在於逐步熔化焊料與緩慢加熱連接介面，避免急速加熱而導致電子元件的損壞。在傳統的回流焊接過程中，通常分為四個階段，稱為「區（Zone）」，每一個區都擁有各自的溫度曲線：「預熱」、「浸熱」、「回流」與「冷却」。 (zh)
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